Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP

Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP

Production Description:

Sapphire wafers are single‑crystal substrates grown from high‑purity aluminum oxide (Al₂O₃) via processes such as the Kyropoulos (KY) and Heat Exchanger Method (HEM). Their molecular structure consists of three oxygen atoms and two aluminum atoms covalently bonded in a hexagonal lattice. This structure endows sapphire wafers with a range of superior properties, making them a key material across multiple high‑precision and cutting‑edge fields.

Product Parameters:

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Product Highlights:

* Sapphire wafers are with common crystallographic orientations include C‑plane (0001), A‑plane (11‑20), and R‑plane (1‑102); the choice of orientation tailors optical, mechanical, and epitaxial behavior for specific devices.

* Typical optical transmission spans the near‑UV to mid‑infrared (approximately 0.19–5.5 μm), with high transparency in the 0.3–5 μm range, supporting applications in optics and optoelectronics.

* Mechanical and thermal properties of sapphire wafers include a Mohs hardness of 9, high strength and wear resistance, and a melting point ~2050°C, enabling performance under extreme environments.

* Chemical stability of sapphire wafers is excellent—resistant to most acids and alkalis—with notable attack only by HF, phosphoric acid, and molten KOH at elevated temperatures.

* Representative applications of sapphire wafers: LED substrates (GaN on sapphire), infrared and laser windows, optical components, and wear‑resistant covers in consumer electronics.

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Q&A:

Q: What is a sapphire wafer?

A: A sapphire wafer is a circular thin slice made of sapphire material, which is widely used in the manufacturing of semiconductors and optical devices.

Q: What size are sapphire wafers?

A: 2inch, 3inch, 4inch, 6inch, 8inch, 12inch.

Q: How to cut a sapphire wafer?

A: Cutting a sapphire wafer requires specialized methods due to its extreme hardness (9 on the Mohs scale, second only to diamond) and brittleness. The core approach relies on abrasive-based or laser-based techniques to achieve precise, low-damage cuts.